Chipset
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Northbridge: Intel® GS45
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Southbridge: Intel® ICH9M-E
Memory
Up to 6MB L2 cache integrated in Core 2 Duo
Up to 4GB DDR3 SDRAM system memory
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Soldered
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800/1067MHz memory bus frequency locked to the FSB frequency
Serial ATA (SATA)
Three ports via ESMexpress® connector
Transfer rates up to 3Gbit/s (SATA 3.0)
Graphics
Integrated in Intel® GS45 chipset
Maximum resolution: 2048 × 1536 pixels (QXGA)
One x16 link (PCI Express® graphics) or
Up to two SDVO ports or
Three DisplayPorts or
Two HDMI ports
One LVDS port (4 bit, max. 1366x768)
Available via ESMexpress® connector
USB
Eight USB 2.0 host ports
UHCI implementation
Data rates up to 480Mbit/s
Available via ESMexpress® connector
Ethernet
Two 10/100/1000Base-T Ethernet channels
Ethernet controllers connected by two x1 PCIe® links
Two LED signals per channel for LAN link, activity status and connection speed
Available via ESMexpress® connector
PCI Express®
Two x1 links to connect local 1000Base-T Ethernet controllers
Four x1 links or one x4 link via ESMexpress® connector (switchable on the carrier)
Data rate 250MB/s in each direction (2.5 Gbit/s per lane)
GPIO
1 line from PIC via ESMexpress® connector
Usable for LED
HD audio
Via ESMexpress® connector
Board Management Controller
Input voltage supervision
Power sequencing
Board monitoring
Watchdog
Accessible via SMBus
Miscellaneous
Real-time clock (with GoldCap or battery backup on the carrier board)
SMBus interface
ESMexpress® Specifications
In accordance with proposed standard ANSI/VITA 59 RSE: Rugged System-On-Module Express
Electrical Specifications
Supply voltage/power consumption:
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+12V (-25%/+33%), power consumption up to 40W
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+5V (-5%/+5%) standby voltage
Mechanical Specifications
Dimensions: 95mm x 125mm
ESMexpress® PCB mounted between a frame and a cover
Weight: 230g (incl. cover and frame)
Environmental Specifications
Temperature range (operation): 0..+85°C Tcase (ESMexpress® cover/frame) (screened)
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms (EN 60068-2-27)
Bump: 10g/16ms (EN 60068-2-29)
Vibration (sinusoidal): 1g/10..150Hz (EN 60068-2-6)
Conformal coating on request
MTBF
154,077h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
EMC behavior depends on the system and housing surrounding the ESMexpress® module. MEN has performed general, successful EMC tests for ESMexpress® using the XC1 evaluation carrier according to EN 55022 (radio disturbance), IEC 61000-4-2 (ESD), IEC 61000-4-3 (electromagnetic field immunity), IEC 61000-4-4 (burst), IEC 61000-4-5 (surge) and IEC 61000-4-6 (conducted disturbances)
BIOS
InsydeH2O™ UEFI Framework
Software Support
Windows® (Windows® XP, Windows® 7)
Linux
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tested/verified with: Ubuntu 10.04 (kernel 2.6.32-21) 32-bit and 64-bit versions
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OpenSuse 11.3 32-bit and 64-bit versions
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and: CentOS 5.5 (kernel 2.6.18) 32-bit and 64-bit versions
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Detailed matrix of supported interfaces under Ubuntu 10.04 and OpenSuse 11.3
VxWorks® (in preparation)
QNX®
For more information on supported operating system versions and drivers see Software.
