XM2 - ESMexpress® with Intel® Core™ 2 Duo

Technical Data

CPU

Intel® Core™ 2 Duo SP9300
• Up to 2.26GHz processor core frequency
• 800/1066MHz system bus frequency

Chipset
• Northbridge: Intel® GS45
• Southbridge: Intel® ICH9M-E

Memory

Up to 6MB L2 cache integrated in Core 2 Duo

Up to 4GB DDR3 SDRAM system memory
• Soldered
• 800/1067MHz memory bus frequency locked to the FSB frequency

Serial ATA (SATA)

Three ports via ESMexpress® connector

Transfer rates up to 3Gbits/s (SATA 3.0)

Graphics

Integrated in Intel® GS45 chipset

Maximum resolution: 2048 × 1536 pixels (QXGA)

One x16 link (PCI Express® graphics) or

Up to two SDVO ports or

Three DisplayPorts or

Two HDMI ports

One LVDS port

Available via ESMexpress® connector

USB

Eight USB 2.0 host ports

UHCI implementation

Data rates up to 480Mbits/s

Available via ESMexpress® connector

Ethernet

Two 10/100/1000Base-T Ethernet channels

Ethernet controllers connected by two x1 PCIe® links

Two LED signals per channel for LAN link, activity status and connection speed

Available via ESMexpress® connector

PCI Express®

Two x1 links to connect local 1000Base-T Ethernet controllers

Four x1 links or one x4 link via ESMexpress® connector (switchable on the carrier)

Data rate 250MB/s in each direction (2.5 Gbits/s per lane)

GPIO

1 line from PIC via ESMexpress® connector

Usable for LED

HD audio

Via ESMexpress® connector

Board Management Controller

Input voltage supervision

Power sequencing

Board monitoring

Watchdog

Accessible via SMBus

Miscellaneous

Real-time clock (with GoldCap or battery backup on the carrier board)

SMBus interface

ESMexpress® Specifications

In accordance with proposed standard ANSI-VITA 59 RSE Rugged System on Module Express

Electrical Specifications

Supply voltage/power consumption:
• +12V (-25%/+33%), power consumption up to 40W
• +5V (-5%/+5%) standby voltage

Mechanical Specifications

Dimensions: 95mm x 125mm

ESMexpress® PCB mounted between a frame and a cover

Weight: 230g (incl. cover and frame)

Environmental Specifications

Temperature range (operation):
• 0..+60°C Tcase (screened)

Temperature range (storage): -40..+85°C

Relative humidity (operation): max. 95% non-condensing

Relative humidity (storage): max. 95% non-condensing

Altitude: -300m to + 3,000m

Shock: 15g/11ms (EN 60068-2-27)

Bump: 10g/16ms (EN 60068-2-29)

Vibration (sinusoidal): 1g/10..150Hz (EN 60068-2-6)

Conformal coating on request

MTBF

tbd @ 40°C according to IEC/TR 62380 (RDF 2000)

Safety

PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers

EMC

Conforming to EN 55022 (radio disturbance), EN55024 EN 61000-4-2 (ESD) and EN55024; EN 61000-4-4 (burst)

BIOS

InsydeH2O™ UEFI Framework

Software Support

Windows®

Linux (in preparation)

VxWorks®

QNX® (on request)

For more information on supported operating system versions and drivers see Software.