Line drivers and/or additional hardware implemented on USM™ Universal Submodule (not included)
Memory
32MB SDRAM memory
•
Soldered
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DDR2
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133MHz memory bus frequency
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FPGA-controlled
8MB non-volatile Flash
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2MB for FPGA data
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6MB for user data or Nios® firmware
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FPGA-controlled
FPGA
Standard factory FPGA configuration:
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Main bus interface
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Altera® SOPC Unit incl. Nios® II/f soft processor, GPIO, UART and DDR2 SDRAM control
•
Wishbone-to-Avalon®/Avalon®-to-Wishbone bridges
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Reset controller, interrupt controller, SMBus controller, GPIO controller
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M-Module™ to Wishbone bridge, ID EEPROM emulation
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16Z045_FLASH - Flash interface
The FPGA offers the possibility to add customized I/O functionality. See FPGA.
USM™ Slot
One slot for a standard USM™ module
For implementation of line drivers and/or additional hardware
Miscellaneous
Eight onboard LEDs at bottom side of board, FPGA-controlled
•
One used to show FPGA load status, seven free for user-defined functions (GPIO)
I²C interface to detect the USM™ module
M-Module™ Characteristics
Compliant with M-Module™ standard
The actual characteristics implemented depend on the USM™ module and FPGA function!
Prepared for A08, A24, D08, D16, D32, INTA, INTB, INTC, DMA08, DMA16, DMA32, TRIGI, TRIGO, IDENT
Peripheral Connections
Via front panel on a shielded 50-pin HP D-Sub SCSI 2 receptacle connector
Electrical Specifications
Isolation voltage:
•
Voltage depends on implementation and signal routing of USM™
•
Voltage between the connector shield and isolated ground is limited to approx. 180V using a varistor; AC coupling between connector shield and isolated ground through 47nF capacitor
Supply voltage/power consumption:
•
+5V (-3%/+5%), 400mA max. (M199 only), 1000mA max. (M199 with USM™)
MTBF: 533,355h @ 40°C according to IEC/TR 62380 (RDF 2000)
Mechanical Specifications
Dimensions: conforming to M-Module™ standard
Weight: 70g (w/o USM™ module)
Environmental Specifications
Temperature range (operation):
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-40..+85°C (qualified components)
•
Airflow: min. 10m³/h
Temperature range (storage): -40..+85°C
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300m to + 3,000m
Shock: 15g/11ms
Bump: 10g/16ms
Vibration (sinusoidal): 2g/10..150Hz
Conformal coating on request
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 (radio disturbance), IEC1000-4-2 (ESD) and IEC1000-4-4 (burst)
Software Support
Nios® sample design for Quartus® II development tools
Flash update tools for Windows®, Linux, VxWorks®
Driver software depending on implemented FPGA functions
For more information on supported operating system versions and drivers see Downloads.
