F204 - 3U CompactPCI® M-Module™ Carrier Board

Compliant with M-Module™ standard

Characteristics: A08, A24, D08, D16, D32, INTA, TRIGI, TRIGO

Peripheral Connections

Via front panel

CompactPCI® Bus

Compliance with CompactPCI® Specification 2.0 R2.1

Only one slot required on the 3U CompactPCI® bus

32-bit/33-MHz PCI-to-M-Module™ bridge
• FPGA-based
• Compliant with PCI Specification 2.2
• Target on PCI bus

V(I/O): +3.3 V (+5 V tolerant)

Electrical Specifications

Supply voltage/power consumption:
• +5 V (-3%/+5%), 20 mA typ.
• +3.3 V (-3%/+5%), 20 mA typ.

MTBF: 1 046 000h @ 40°C (derived from MIL-HDBK-217F)

Mechanical Specifications

Dimensions: conforming to CompactPCI® specification for 3U boards

Front panel: aluminum with 1 handle, cut-out for front connector of M-Module™

Weight: 130 g (without M-Modules™)

Environmental Specifications

Temperature range (operation):
• 0..+60°C or -40..+85°C
• Airflow: min. 10m³/h

Temperature range (storage): -40..+85°C

Relative humidity (operation): max. 95% non-condensing

Relative humidity (storage): max. 95% non-condensing

Altitude: -300 m to + 3 000 m

Shock: 15 g, 11 ms

Bump: 10 g, 16 ms

Vibration (sinusoidal): 2 g, 10..150 Hz

Conformal coating on request

Safety

PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers

EMC

Tested according to EN 55022 (radio disturbance), IEC61000-4-2 (ESD) and IEC61000-4-4 (burst)

Software Support

M-Module™ drivers for Windows®, VxWorks®, Linux, QNX®, OS-9® as supported

Basic board driver included in MDIS™ system package for the respective operating system

M-Module™ Characteristics

A08/D16 or A24/D32

Operation Temperature

0..+60°C

-40..+85°C

Cooling Concept

Also available with conduction cooling in MEN CCA frame

Please note that some of these options may only be available for large volumes. Please ask our sales staff for more information.

For operating systems not mentioned here contact MEN sales.