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Rugged COMs for Mobile Applications

  • Intel® Atom™ and Intel® Core™
  • PowerPC® QorIQ™, PowerQUICC™ III, e300, e500mc
  • Conduction or convection cooled
  • 100% EMC-proof aluminum enclosure
  • 95 x 55 mm or 95 x 125 mm
  • -40°C to +85°C operating temperature


Compare MEN Computer-On-Modules

Safe and Rugged Computer-On-Modules (19-page overview)

Being compact, flexible and rugged, ESMexpress® and ESMini COMs are especially suited for medical engineering, aerospace, railways or mobile applications in general.