Log in News & Media | Downloads | Corporate | Careers | Legal Notes
(215) 542-9575
sales@menmicro.com

CB70C - Rugged COM Express with Intel Core i7

VITA 59 RCE Module

The CB70C is a conduction-cooled VITA 59 Rugged COM Express type 6 module controlled by a third generation Intel Core i7 (gen 3).

Download data sheet

  • CB70C Product ImageCB70C Rugged COM Express (VITA 59 RCE) with Intel Core i7
  • CB70C Product ImageRugged COM Express Basic module inside Rugged COM Express frame and cover
  • CB70C Product ImageCB70C Rugged COM Express Basic module on Rugged COM Express frame and cover
  • CB70C Product ImageCB70 COM Express model
  • CB70C Product Image
  • CB70C Product Image
  • CB70C Product Image
  • CB70C Product Image

Main Features

  • Intel Core i7, 3rd generation
  • Quad-core 64-bit processor
  • Up to 16 GB DDR3 DRAM, ECC, soldered
  • Board Management Control
  • Active Management Technology
  • Open CL 1.1 support
  • 9 V to 16 V extended input range
  • -40°C to +85°C Tcase screened, depending on processor
  • Conduction cooling
  • VITA 59 in process, compliant with COM Express Basic, type 6
  • PICMG COM.0 COM Express version also available
CB70C Product Image

Technical Data

CPU
  • The following CPU types are available:
    • Intel Core i7 (3rd gen)
    • Intel Core i5 (3rd gen)
    • Intel Core i3 (3rd gen)
    • Intel Celeron (2nd or 3rd gen)
  • Chipset
    • Intel Core i7-3612QE (QM77 Platform Controller Hub (PCH))
  • For more details please see the overview matrix of supported processor types.
Memory
  • System Memory
    • Soldered DDR3
    • 2 GB, 4 GB, 8 GB or 16 GB
  • Boot Flash
    • 16 MB
Graphics
  • Integrated in processor and chipset
  • Maximum resolution: 2560 x 1600 pixels
Onboard Interfaces
  • Available via COM Express connectors
  • Video
    • One x16 link (PCI Express graphics)
    • One VGA
    • Three DDI ports for DP, HDMI, DVI, SDVO
    • One LVDS dual channel up to 48-bit RGB
  • Audio
    • HD audio
  • Serial ATA (SATA)
    • Two ports with SATA Revision 2.x support; transfer rates up to 300 MB/s (3 Gbit/s)
    • Two ports with SATA Revision 3.x support; transfer rates up to 600 MB/s (6 Gbit/s)
    • RAID level 0/1/5/10 support
  • USB
    • Four USB 3.0 host ports, xHCI implementation, data rate up to 5 Gbit/s
    • Four USB 2.0 host ports, EHCI implementation, data rates up to 480 Mbit/s
  • Ethernet
    • One 10/100/1000Base-T Ethernet channel
    • Three LED signals for LAN link, activity status and connection speed
  • PCI Express
    • Seven x1 links (up to 500 MB/s in each direction), PCIe 2.x (5 Gbit/s per lane)
  • GPIO
    • 8 lines
  • SMBus interface
  • LPC
  • SPI
  • Speaker
Supervision and Control
  • Input voltage supervision
  • Power sequencing
  • Board monitoring
  • Watchdog
  • Accessible via SMBus
  • Real-time clock, with supercapacitor or battery backup on the carrier board
Computer-On-Module Standard
  • CB70C: VITA 59 RCE: Rugged COM Express in process
    • With conduction cooling cover and frame
    • Rugged COM Express Basic, Module Pin-out Type 6
  • CB70: PICMG COM.0 COM Express Module Base Specification
    • Without conduction cooling wings, without cover and frame
    • COM Express Basic (135 mm x 105 mm), Module Pin-out Type 6
Electrical Specifications
  • Supply voltage
    • +12V (9 to 16 V)
    • +5V (-5%/+5%) standby voltage
  • Power consumption
    • 48 W typ./ 70 W max.
    • 1.1 W in standby operation
Mechanical Specifications
  • Dimensions:
    • 135 mm x 105 mm x 18 mm (height) (conforming to VITA 59 RCE Basic format), PCB mounted between a cover and a frame (model 15CB70C00/15CB70C01)
    • 125 mm x 95 mm (conforming to PICMG COM.0 COM Express Basic format) (model 15CB70-00)
  • Weight:
    • 460 g (model 15CB70C00/15CB70C01)
    • 90 g (model 15CB70-00)
Environmental Specifications
  • Temperature range (operation): -40..+85°C Tcase (Rugged COM Express cover/frame) (screened)
  • Temperature range (storage): -40..+85°C
  • Cooling Concept
    • Conduction-cooled versions according to VITA 59 RCE: Rugged COM Express in process
    • Air-cooled versions according to PICMG COM.0 COM Express standard
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to +3000 m
  • Shock: 50 m/s², 30 ms (EN 61373)
  • Vibration (function): 1 m/s², 5 Hz - 150 Hz (EN 61373)
  • Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz (EN 61373)
  • Conformal coating on request
Reliability
MTBF
  • 415 714 h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety
Flammability
  • UL 94V-0
EMC
  • EMC behavior depends on the system and housing surrounding the COM Express module.
  • The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
    • EN 55022 (radio disturbance)
    • IEC 61000-4-2 (ESD)
    • IEC 61000-4-3 (electromagnetic field immunity)
    • IEC 61000-4-4 (burst)
    • IEC 61000-4-5 (surge)
    • IEC 61000-4-6 (conducted disturbances)
Software Support
  • Windows
  • Linux
  • For more information on supported operating system versions and drivers see Software.
BIOS
InsydeH2O UEFI Framework

Ordering Information

Standard CB70C Models
15CB70-00

COM Express "Basic", type 6, Intel i7-3612QE, 2.1 GHz, 8 GB RAM, -40..+85°C Tcase screened; without VITA-59 conduction cooling frame

15CB70C00

Rugged COM Express "Basic", type 6, Intel i7-3612QE, 2.1 GHz, 8 GB RAM, -40..+85°C Tcase screened; with VITA-59 conduction cooling frame

15CB70C01

Rugged COM Express "Basic", type 6, Intel Celeron 827E, 1.4. GHz, 2 GB RAM, -40..+85°C Tcase screened; with VITA-59 conduction cooling frame

Related Hardware
08XC15-00
XC15 - Rugged COM Express Carrier Board

XC15, evaluation and development board for COM Express and Rugged COM Express (VITA-59) modules

Details

Software

Linux
13Y004-06

MDIS5 low-level driver sources (MEN) for generic SMBus driver for F14, F15, F17, F18, F19P, F21P, F22P, F75P, G20, G22, D9, D601, F600 and F601, A19, A20, F217, CB70C, SC24, AF2, BC50M, BC50I, BL50W and MH50C

13MM02-90

Linux driver (MEN) for RX8581 real-time clock for CB70C, F75P, MM2, SC24, SC25, BC50M, BC50I, BL50W, BL50S, BL70W and BL70S. Please note that this driver is already included in upstream Linux kernels starting from 3.14!

13MD05-90

MDIS5 System (and Device Driver) Package (MEN) for Linux. This software package includes most standard device drivers available from MEN.

Windows
10Y000-78

Windows Embedded Standard 7 BSP for F19P, F21P, F22P, F23P, G20, G22, G23, CB70C, CB70, XM2, MM2, BC50M, BC50I, BL50W, BL50S, BC70M, BL70S, BL70W, BL70E, DC2, F205, F206, F210, F215, F216, G215, P506, P507 and P511

13Y021-70

Windows ERTC/SMB support package

13T035-70

Windows 7/8 64-bit graphics driver (Intel) for F22P, G22, CB70C, SC25, BL70W and BL70S

13T034-70

Windows 7/8 32-bit graphics driver (Intel) for F22P, G22, CB70C, SC25, BL70W and BL70S

13T029-70

Windows Intel Management Engine Driver (Intel) for G22, F22P and CB70C

13T020-70

Windows 64-bit network driver (Intel) for F18, F18E, F19P, F21P, F22P, F23P, G20, G22, G23, G25A, GM1, GM2, GM3, G211, G211F, XM2, CB70C, SC24, BC50I, BC50M, BL50W, BL50S, BL70W and BL70S

13T010-70

Windows 32-bit network driver (Intel) for XM1, XM1L, XM2, MM2, CB70C, F11S, F18, F18E, F19P, F21P, F22P, F23P, G20, G22, G23, G25A, GM1, GM2, GM3, G211, G211F, SC24, BC50I, BC50M, BL50W, BL50S, BL70W and BL70S

13T003-70

Windows chipset driver (Intel) for F14, F15, F17, F18, F18E, F19P, F21P, F22P, G20, G22, XM2, CB70C, D9, D6, D7, D601, A19 and A20

Firmware/BIOS
This product includes a specially adapted BIOS.
14CB70-00

System BIOS for CB70C and CB70