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F701 - MVB Interface Board

3U CompactPCI

The F701 is a MVB (Multifunction Vehicle Bus) EMD/ESD+ to CompactPCI interface and consists of an IEC 61375 (TCN) compliant MVB controller, a local CPU and a CompactPCI slave interface.

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  • F701 Product ImageF701 3U CompactPCI MVB Interface Card
  • F701 Product ImageF701 - MVB Interface Card
  • F701 Product ImageF701 - MVB Interface Card
  • F701 Product Image
  • F701 Product Image
  • F701 Product Image

Main Features

  • 4HP 32-bit/33-MHz CompactPCI
  • MVB Interface EMD/ESD+ according to IEC 61375 (TCN Standard)
  • MVB Bus Administrator
  • 4096 Process Data ports
  • Message Data stack
  • Driver support for WinXP, Win7 32/64bit and Linux
  • -40 °C to +70 °C
F701 Product Image

Technical Data

MVB Multifunction Vehicle Bus Interface
  • Data rate: 1.5 Mbit/s
  • Data frame size: 16 - 256 bits
  • Cyclic transmission of process data (PD) (broadcast)
    • Control and status information
    • Periodic broadcast communication: 16-512 ms, 1 ms possible (real-time)
    • Up to 4096 telegrams (ports), at max. 32 bytes each
  • Event driven message data transfer (MD) (point-to-point)
    • For online diagnostics, passenger information in normal operation
    • For firmware download and collecting debugging data in field service
    • On demand communication
    • Destination addressed
    • Response time: > 0,5 sec
  • Bus Administrator communication manager (BA)
    • Synchronous, time-multiplexed communication
    • Transmission data sequence organization (master_frame - slave_frame)
  • Full redundancy support
  • Physical layers
    • ESD + (Electrical Short Distance) or EMD (Electrical Middle Distance)
    • 20 m (ESD+) or 200 m (ESD+ and EMD), 32 nodes
    • Galvanic isolation
    • Compliant to TCN standard IEC 61375
  • MVB Connectors
    • Two 9-pin D-Sub connectors on the front panel
    • Both male (MVB 1) and female (MVB 2) D-Sub connectors
    • Direct connection between D-Subs is possible
    • M3 metric inner threading
CompactPCI Interface
  • 32-bit/33-MHz at connector J1
  • Signaling voltage: +5.0 V
  • Compliant with PICMG 2.0 R3.0
  • For data communication path between F701 and host
Serial Line Interface
  • For software debugging
  • Transmission parameters: 115 kBaud
  • Handshake lines: None
JTAG Interface
For debugging and loading the flash memory
  • 256 KB SRAM
    • Traffic Memory for MVB interface
  • 256 - 1280 KB SRAM
    • General purpose memory
  • 1 MB Flash
Software Structure Configurations
    • Passive interface
    • Communication capabilities: PD and BA
    • Active interface
    • Communication capabilities: PD, MD and BA
  • Diagnostic by LED
    • 8 diagnostic LEDs
    • Used for self test purposes
    • Displays the test number
    • Indicates reason for failure
  • Reset Mechanism
    • Onboard under-voltage supervision circuitry
  • Power Up (PLD Loading)
    • Automatically loads the PLD chips after power-on
Mechanical Specifications
  • Dimensions (L x W x H): 160 mm x 100 mm x 20.32 mm
  • Weight: 158 g
Environmental Specifications
  • Temperature range (operation): -40..+85°C
  • Relative humidity: max. 95%
  • Altitude: Max 1800 m
  • Shock: 50 m/s² (duration 50 ms)
  • Vibration:
    • 2 mm for 5 - 25 Hz
    • 50 m/s² for 25 - 150 Hz
  • RFI susceptibility from 0,15 to 2000 MHz: 20 V/m (class FS2 in EN 50155)
Operating Systems
  • Windows 7
  • Linux (tested with Ubuntu 14.04 LTS)
  • For information on additional operating systems, please contact our sales staff.
  • For more information on supported operating system versions and drivers see Software.
Standards Conformity
  • EN 50121-3-2:2006: Electromagnetic compatibility
  • IEC 61375-1:2007: MVB physical layer isolation
  • EN 50155:2007 12.2.9: Isolation measurement test/voltage resistance test
  • EN 50155:2007 4.1.3: Shock and vibration
  • IEC 61375-1:2007: MVB (Clause 3, Multifunction Vehicle Bus)
  • EN 60068-2-30:2006: Humidity


MVB Interface
  • ESD+ (Electrical Short Distance)
  • EMD (Electrical Middle Distance)
MVB Software Protocols
  • Configuration MDFULL
    • For applications requiring Process Data (PD) only
  • Configuration SERVER
    • For applications requiring Process Data (PD) and Message Data (MD)
  • Bus Administrator (BA) optional

Ordering Information

Standard F701 Models

MVB ESD+ Device, Process and Message Data, -40..+70°C screened, conformal coating


MVB ESD+ Bus Administrator, Process and Message Data, -40..+70°C screened, conformal coating


MVB EMD Device, Process and Message Data, -40..+70°C screened, conformal coating


MVB EMD Bus Administrator, Process and Message Data, -40..+70°C screened, conformal coating



Linux MDFULL MVB driver (duagon)


Linux SERVER MVB driver (duagon)


Windows 7 MDFULL MVB driver (duagon)


Windows 7 SERVER MVB driver (duagon)


For further information or additional documentation, please contact either MEN sales or duagon directly www.duagon.com.


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