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CC10 - Rugged COM Express Module with ARM i.MX6

COM Express Compact, Type 6

The CC10 is an ARM i.MX6 based Rugged COM Express type 6 module with a Cortex-A9 architecture and an onboard FPGA for flexible, customizable I/O. It is designed for industrial automation, medical computers, in-vehicle computers, and embedded computers in transportation. The CC10 supports conductive cooling technology and is 100% EMC proof.

  • CC10 Product ImageCC10 - Rugged COM Express Module with ARM i.MX6
  • CC10 Product ImageCC10C - Ultra-Rugged COM Express module on Conduction Cooling Frame
  • CC10 Product ImageCC10 - Rugged COM Express Module with ARM i.MX6
  • CC10 Product ImageCC10C Ultra-Rugged COM Express Module inside Rugged COM Express Frame and Cover
  • CC10 Product Image
  • CC10 Product Image
  • CC10 Product Image
  • CC10 Product Image

Main Features

  • NXP ARM i.MX 6 Series
  • Quad-core processor
  • Comprehensive usage of i.MX 6 I/O
  • Configurable FPGA I/O with 140 pins
  • Maximum flexibility in interface configuration
  • Up to 4 GB DDR3 SDRAM
  • eMMC multimedia card
  • U-Boot Universal Boot Loader
  • -40 °C to +85 °C Tcase
  • Conduction cooling
  • Compliant with COM Express Compact, type 6
  • PICMG COM.0 and Ultra-Rugged COM versions
CC10 Product Image

Technical Data

  • NXP ARM i.MX 6 Series (ARM Cortex-A9 architecture)
  • The following CPU types are supported:
    • i.MX6S (i.MX 6Solo family)
    • i.MX6DL (i.MX 6DualLite family)
    • i.MX6D (i.MX 6Dual family)
    • i.MX6Q (i.MX 6Quad family)
  • See overview of supported processor types for processor options and a feature matrix of the i.MX 6 series.
  • System RAM
    • Soldered DDR3
    • 4 GB max.
  • Boot Flash
    • 16 MB max.
Mass Storage
The following mass storage devices can be assembled:
  • eMMC device, soldered; different sizes available
  • Integrated in i.MX 6 processor
  • Multi-stream-capable HD video engine delivering up to 1080p60 decode, 1080p30 encode and 3D video playback in HD
  • Maximum resolution: 1920 x 1200 pixels (WUXGA)
  • Superior 3D graphics performance with up to four shaders performing 200 Mt/s and OpenCL support
  • Separate 2D and/or OpenVG Vertex acceleration engines for optimal user interface experience
  • Stereoscopic image sensor support for 3D imaging
  • Video
    • 1x HDMI/DVI, board to board
    • 1x LVDS, dual-channel, board to board
    • 1x MIPI CSI-2 camera serial host interface, board to board; optional
  • Audio
    • 1x AC'97 audio, board to board
    • 1x I2S audio, board to board
  • SATA
    • 1x SATA Revision 2.x, board to board; only with i.MX6D or i.MX6Q
    • 1x, board to board, for MMC/SD/SDIO cards
  • USB
    • 2x USB 2.0, board to board, or
    • 7x USB 2.0, board to board
    • One channel always implemented as OTG (On-The-Go) host/client channel
  • Ethernet
    • 1x 1000BASE-T, board to board
    • 1x 100BASE-T, board to board; optional
    • Link and activity LED signals
  • PCI Express
    • 1x PCIe 1.1 x1, board to board
  • ExpressCard
    • 1x, board to board
  • Serial
    • 6x UART, board to board, max., 4 Mbit/s max.
    • Physical interfaces RS232 or RS422/RS485 depending on interface controller and implementation on carrier board
  • CAN bus
    • 2x, board to board, 2.0B CAN protocol, 1 Mbit/s
    • 2x additional, board to board, 2.0A/B CAN protocol, 1 Mbit/s; with FPGA; optional
    • External transceivers to be implemented on carrier board
  • PWM
    • 3x PWM, board to board
  • I2C
    • 4x I2C, board to board, max.
  • SPI
    • 3x SPI, board to board, max.
  • Power and system management control signals
  • GPIO
    • 9x GPIO, 4x GPO, 3x GPI, board to board
    • 64x GPIO, board to board, with FPGA; optional
  • No FPGA assembled, with custom configuration of i.MX 6 I/O interfaces, or
  • FPGA Altera Cyclone IV, with custom IP core and i.MX 6 I/O configuration
    • Total available pin count: 140 pins on COM Express connectors
  • The IP cores that make sense and/or can be implemented depend on the board model, available pin counts and number of logic elements. Please contact MEN for information on feasibility.
Supervision and Control
  • Power supervision and watchdog
  • Temperature measurement
    • i.MX 6 temperature measurement
    • Additional onboard temperature sensor; optional
  • Real-time clock, buffered by supercapacitor or battery on the carrier board
Product Standard
  • Compact, Type 6, PICMG COM.0 COM Express Module Base Specification
  • Compact, Type 6, Ultra-Rugged COM
Electrical Specifications
  • Supply voltage
    • +12 V (9 to 16 V)
  • Power consumption
    • 12 W, measured in stress test using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
    • 7.4 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
    • 5 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10-00, i.MX6S single-core @ 800 MHz
Mechanical Specifications
  • Dimensions
    • COM Express Compact: (W) 95 mm, (D) 95 mm
    • Ultra-Rugged COM Compact: (W) 105 mm, (D) 105 mm, (H) 18 mm
  • Weight
    • 356 g (model 15CC10C00)
    • 40 g (model 15CC10-00)
  • Cooling
    • Conduction cooling
    • Air cooling
Environmental Specifications
  • Temperature range (operation)
    • -40 °C to +85 °C Tcase (conduction-cooling cover/frame) (model 15CC10C00)
    • -40 °C to +85 °C (model 15CC10-00)
  • Temperature range (storage): -40 °C to +85 °C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to +3000 m
  • Shock: 50 m/s², 30 ms (EN 61373)
  • Vibration (function): 1 m/s², 5 Hz to 150 Hz (EN 61373)
  • Vibration (lifetime): 7.9 m/s², 5 Hz to 150 Hz (EN 61373)
  • 652 986 h predicted @ 40 °C according to IEC/TR 62380 (RDF 2000) (model 15CC10C00)
  • 1 233 470 h predicted @ 40 °C according to IEC/TR 62380 (RDF 2000) (model 15CC10-00)
Flammability (PCBs): UL 94 V-0
  • EMC behavior generally depends on the system and housing surrounding the COM module.
  • The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
    • EN 55022 (radio disturbance)
    • IEC 61000-4-2 (ESD)
    • IEC 61000-4-3 (electromagnetic field immunity)
    • IEC 61000-4-4 (burst)
    • IEC 61000-4-5 (surge)
    • IEC 61000-4-6 (conducted disturbances)
Software Support
  • Linux
  • VxWorks
  • See also Application Note Recommendations for a Robust Software Setup
  • For more information on supported operating system versions and drivers see Software.
BIOS/Boot Loader
U-Boot Universal Boot Loader

Ordering Information

Standard CC10 Models

COM Express "Compact", type 6, Freescale i.MX6S, 0.8 GHz, 1 GB RAM, 4 GB eMMC, 2 USB, 1 Gb ETH, no FPGA, -40..+85°C with qualified components; without conduction cooling frame


Ultra-Rugged COM Express "Compact", type 6, Freescale i.MX6Q, 1 GHz, 2 GB RAM, 4 GB eMMC, 6 USB, 1 Gb Ethernet, 1 Fast Ethernet, PCIe 1.1, with FPGA, -40..+85°C Tcase with qualified components; with conduction cooling frame

Miscellaneous Accessories

Heat spreader for COM Express CC10 and display controller CC10S

Related Hardware
XC15 - Rugged COM Express Carrier Board

XC15, evaluation and development board for CC10C Rugged COM Express module, dual channel LVDS, 1 HDMI signal (via DisplayPort connector) + 1 DisplayPort to DVI cable, 1 HD audio AC97, 1 GB Ethernet, 1 SATA connector, 4 USB 2.0, 1 USB OTG, 1 RS232 (second UART with additional SA-Adapter), 2 CAN bus, 1 SD card slot, 1 PCI Express card slots x1, 1 PCIe Mini Card slot (USB2.0), audio, 0..+60°C




Linux BSP (MEN) for CC10C, CC10 and CC10S


MDIS5 low-level driver sources (MEN) for 16Z034_GPIO, 16Z037_GPIO and 16Z127_GPIO


MDIS5 System (and Device Driver) Package (MEN) for Linux. This software package includes most standard device drivers available from MEN.


MDIS5 low-level driver sources (MEN) for 16Z034_GPIO, 16Z037_GPIO and 16Z127_GPIO


MDIS5 System (and Device Driver) Package (MEN) for VxWorks. This software package includes most standard device drivers available from MEN.


VxWorks BSP (MEN) for CC10C, CC10 and CC10S

This product uses the U-Boot bootloader available from DENX together with board-specific additions from MEN.

U-Boot Bootloader (DENX/MEN) for CC10C, CC10 and CC10S

Application Examples

Speed Camera Control

The speed camera control application is based on a Computer-On-Module concept, alternatively a 19” CompactPCI solution, depending on the complexity of the control tasks.

Tightening System

The computing core for the industrial tightening system is based on PowerPC Computer-On-Module technology.

Robot Control

High-speed, high-precision robots are needed in the production process of plastics materials, in painting, for semiconductor production in clean rooms, for machine tending and all general automation purposes.

Infusion Pump Gateway Computer

This infusion pump gateway computer is the heart of a system that controls up to 24 infusion pumps.

Textile Machine Supervision

These Human-Machine Interfaces based on the computer-on-module concept are used in the interaction with different types of textile machines.

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